Full-Automatic High-Temperature Dust And Oxygen-Free Oven
Merchandise number：AQHWOL
Description：
- The fully automated oven can be paired with EFEM or robotic arms, and relevant data can be directly uploaded to the server, achieving the goal of unmanned factory.
- Built-in sensors.
- Built-in motor drives.
Features
Automation Control and IoT Integration- Built-in Sensors：To detect temperature, gas (O2 / N2) concentration, AGV battery capacity, positions of materials (Loader/Unloader/Ovens), and the status of automatic doors (open/close).
- Built-in motor drives：Installing automatic switching motors and controllers for the oven, AGV (drive motors and stacking), and air flow control motors, each equipped with a networked PLC controller in both loader and oven. The connectivity between the loader and robotic arms is established through Wi-Fi.
Applications
Industry automation in manufacturing for drying productions includes semiconductor, IC, PCB,Panel, ABF, LED, and electronics manufacturing. The equipment such as industrial dust-free drying oven, semiconductor industrial oven, circuit board industrial oven, PCB industrial oven, touch panel drying equipment, ABF carrier board industrial oven, N2 hot air oven.
PC/PLC Controlled Oven Specification
| Specification | |
| Process Temperature | RT ~450℃ |
| Temperature uniformity | ± 1.5% |
| Cleanliness | ISO14644-1 Class 5 @ 0.3 µm |
| Cooling Method | Air Cooling(N2/CDA)、Water Cooling |
| Compatible Equipment | EFEM 、Robotic arm |
| Oxygen Concentration | 20ppm |
| Operation Interface | User-Friendly operation interface, complies with CIM, Ethernet & SECS/GEM, PCB ECI |
| Options | ．Fast air-cooling system ．Solvent recovery system ．Quick-detachable inner liner |
| Process | Curing for chips and substrates in PR/PI processes; ideal for wafer-level and fan-out panel level packaging, providing the optimal curing solution. |
