Innovative Breakthrough in Semiconductor Drying Process: Full-Automatic High-Temperature Dust And Oxygen-Free Oven

As a leading brand in the industrial drying technology field, WEISUN focuses on the research, design, manufacturing, and integration of automatic drying equipment to meet the stringent demands of various industrial processes. At the upcoming 2024 SEMICON Taiwan exhibition, we will showcase our latest equipment combining advanced light and heat technology with artificial intelligence, further driving technological innovation in smart factories and move towards Industry 5.0 together!

We continually strive for technological innovation and focus on enhancing technical support and system integration. Our latest breakthrough is the development of a full-automatic high-temperature dust and oxygen-free oven that meets the stringent standards of the semiconductor industry. This equipment can be equipped with an EFEM, features standard wafer loading ports, and collaborates with FOUP and robotic arms to achieve high-efficiency wafer loading and unloading, realizing the goal of unmanned factory.

Key Features of the Full-Automatic High-Temperature Dust And Oxygen-Free Oven Showcased at the Exhibition:

Patent Stepless Control Damper：Equipped with a patented stepless control damper, this feature allows precise program-controlled valve plate adjustments to create a highly airtight oxygen-free environment, adaptable to various customized process requirements.

Temperature Uniformity Adjustment Device：The oven is equipped with a precise temperature uniformity adjustment device that regulates the angle of the air outlets, minimizing temperature differences caused by thermal convection. This ensures uniform temperature distribution across all zones within the oven, meeting the specific temperature requirements of the process. The equipment is capable of reaching a max temperature of 450°C.

High-Temperature High-Efficiency Filter：Equipped with a Japanese-made high-temperature filter using a special sealing technique, the system effectively maintains the cleanliness inside the oven, ensuring high product yield.

Oven Pressure Regulating Device：Precisely controls the internal pressure of the oven, providing more stable process conditions.

Chamber Cooling Interlayer：The cooling layer and heat dissipation fins designed at the outer edge of the chamber wall use forced air convection to accelerate the cooling rate while maintaining the stability of the oxygen-free environment inside the oven.

Electrical Component Wiring：Features a one-line design that complies with electrical regulations and customer wiring specifications, effectively preventing poor connections and ensuring safety.

Rear Maintenance Door： The oven is equipped with a rear maintenance door for convenient maintenance and servicing, allowing for offline repairs without affecting the operation of other equipment.

Wafer Fixture： Suitable for 8-inch and 12-inch wafers, it uses high-temperature, dust-free metal materials and features a special positioning structure to prevent position or size deviations, ensuring assembly precision.

Automated Oven Door： Equipped with an automatic oven door, driven by a motor that powers the lifting mechanism on both sides, and includes safety devices to ensure synchronized and safe movement.

Digitalization and Digitization：Achieves digital and intelligent management of processes through sensors and actuators, digitizing and quantifying the operational workflows. Information can be monitored in real-time through a networked PLC and uploaded via WIFI to the W-AIMS WEISUN Artificial Intelligent Management System, achieving a highly efficient and unmanned factory through digital and numerical analysis.

This equipment is widely used in industries such as semiconductors, PCB, ABF substrates, and LED. It provides a one-stop solution for customers, helping achieve highly automated and intelligent production while ensuring precise production efficiency and product yield accuracy.

SEMICON Taiwan 2024 Exhibition Information